Documents
Design Support
Software
| Features | Details |
|---|---|
| Kintex UltraScale+ FPGA SoM | Compatible FPGAs with B2104 package:
Up to 1,842K Logic Cells |
| CPU | Dual Arm Cortex-A7 core processor Operation frequency of 1.2GHz QorIQ Trust Architecture and Arm TrustZone High-speed serial interfaces (SERDES) x4 @6Gbps |
| Memory & Storage | Dual 64-bit DDR4 with ECC from FPGA 128MB QSPI Flash 32bit DDR4 with ECC from CPU 256MB parallel NOR Flash 4MB MRAM 512KB SRAM via SPI |
| Other On SOM Features | 10/100/1000 Ethernet PHY Temperature Sensor TPM2.0 Module via SPI |
| Board to Board Connector1 Interfaces(240pin) | FPGA GTY Transceiver x12 up to 16Gbps 80 SE FPGA Ios 6Gbps SerDes x2 (PCIe/SATA/SGMII) |
| Board to Board Connector2 Interfaces(240pin) | FPGA GTY Transceiver x4 up to 16Gbps 46 LVDS/92 SE FPGA IOs USB 3.0 x1 6Gbps SerDes x1 (PCIe/SATA/SGMII) Gigabit Ethernet x 1 USB2.0 x1 I2C x 2 Debug UART and UART x 2 JTAG |
| Board to Board Connector3 Interfaces(240pin) | FPGA GTY Transceiver x24 up to 32Gbps2 |
| Board to Board Connector4 Interfaces(80pin) | FPGA GTY Transceiver x8 up to 32Gbps |
| General Features |
|

- 100G Ethernet though QSFP28/QSFP+ Connector
- 112G FireFly Connector
- FMC High Pin Count (HPC) Connector
- FMC+ High Pin Count (HPC) Connector
- PCIe Gen2 x1 Connector
- M.2 SATA 3.1 Connector
- USB 3.0 OTG through TypeC Connector
- Gigabit Ethernet through RJ45MagJack
- USB2.0 OTG through MicroAB Connector
- Dual PMOD Connector
- Operating Temperature: -20°C to +85°C
- Form Factor : 140mm x 170mm
Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink and Fan Sink solutions for the ZU7/5/4 Zynq UltraScale+ MPSoC SOM.



