Versal™ AI Edge
System on Module
- VersalTMAI Edge with SFVA784 package
- Compatible with VE2302/2202/2102/2002/VM1102 devices
- Up to 328K Logic cells & 150K LUTs
- 4GB LPDDR4 Memory
- 16GB eMMC Flash and 256MB QSPI Flash
- 2 x 240pin High-Speed Connectors with 98 user IOs
Documents
| Features | Details |
|---|---|
| Versal SoC | Xilinx VersalTM AI Edge/Prime SFVA784 package Dual ARM Cortex-A72 core processor Dual Core ARM Cortex-R5F Up to 328K/150K Logic Cells GTYP Transceivers x 8 @32Gbps 39LVDS Pairs and 20SE PL IOs |
| PMIC | Dialog’s DA9062 PMIC with RTC |
| Clock | Clock Synthesizer |
| Memory & Storage | 4GB LPDDR4 16GB eMMC Flash Expandable up to 64GB 256MB QSPI Flash |
| Other Features | 10/100/1000 Ethernet PHY USB2.0 Transceiver PHY FAN Header |
| Board to Board Connector1 Interfaces(240pin) | From PL Block
|
| Board to Board Connector2 Interfaces(240pin) | From PL Block
From PS Block
|
| General Features |
|
- FMC+ High Serial Pin Count (HSPC) Connector
- 4K HDMI 2.0 IN and OUT through HDMI Connector
- 12G SDI Video IN and OUT through HD BNC Connector
- Dual Gigabit Ethernet through RJ45MagJack
- USB Type-C for JTAG and PS Debug port
- USB 2.0 Interface through USB Type C Connector
- Micro SD
- PMOD Connector
- 60 Pin GPIO Header (For PS IOs)
- Operating Temperature: -20°C to +85°C
- Form Factor: 120mm x 120mm
Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink solutions for Versal AI Edge -based SoMs to ensure optimal thermal management.
Related Products
