Documents
| Features | Details |
|---|---|
| CPU | RFSoC ZU49/ZU39/ZU29DR Processing System (PS)
Programming Logic (PL)
|
| Memory | 8GB DDR4 RAM for PS with ECC 8GB DDR4 RAM for PL |
| Storage | 32GB eMMC Flash Expandable up to 128GB |
| Board to Board Connector1 Interfaces (400pin) | ADC: 16 x ADC Channels up to 2.5Gsps DAC: 16 x DAC Channels up to 10Gsps PL Ios: PL IOs – 188 IOs
|
| Board to Board Connector2 Interfaces (400pin) | From PL Block
From PS Block
Clock signals
|
| General Features |
|

RF DAC/ADC Specifications:
-
- 8 RF RT SMA connectors with Balun(BW-800MHz-1GHz)
- 8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
- 8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz)
- 8 RF ST SMA connectors with Balun(BW-10MHz-3GHz)
High Speed and Interface Specifications:
-
- PCIe Gen3 x8 Edge Connector.
- FMC+ High Pin count(HPC) connector
- 4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
- NVMe PCIe Gen2 x2 M.2 Connector
- Gigabit Ethernet through RJ45MagJack
- Debug & DATA UART/JTAG through Type-C Connector
- Operating Temperature: 30°C to +85°C
- Form Factor: 254mm x 111.15mm (3/4 Length PCIe Card)


Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Spreader and Fan Sink solutions for RFSoC-based SoMs to ensure optimal thermal management.



