Zynq™ UltraScale+™ ZU15/ZU9/ZU6 System on Module

• • Quad-core ARM Cortex-A53 MPCore @1.5GHz
  • Dual-core ARM Cortex-R5 MPCore @600MHz
  • Arm Mali-400MP2 GPU

Programming Logic (PL/FPGA)

• • Up to 747K Logic cells & 341K LUTs
  • High Speed GTH Transceivers x 16 (Up to 16.3Gb/s)

• • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN interface x 2

From PL Block

• • High Speed GTH Transceiver Lanes x 12 (Up to 16.3Gbps)
  • HD Bank IOs – Up to 23LVDS/46 Single Ended IO’s
  • ADC Input pins- Up to 20 Differential/Single Ended from HD Banks

• • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • SD (4bit) x 1
  • Debug UART & Data UART x 1
  • SPI x 1
  • I2C x 2 Port
  • JTAG x 1

From PL Block

• • High Speed GTH Transceiver Lanes x 4 (Up to 16.3Gbps)
  • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks

• Power Input: 5VDC +/- 5% input from B2B Connector2
• Form Factor: 95mm X 75mm(OREN)
  BSP Support: Linux
• Operating Temperature: -40°C to +85°C (Industrial)
• Environment Specification: REACH & RoHS3 Compliant
• Compliance: CE*