Documents
Documents
Design Support
Application Notes
| Features | Details |
|---|---|
| CPU | ZU19/ZU17/ZU11 EG Processing System (PS)
Programming Logic (PL)
|
| Memory | 64bit, 4GB DDR4 RAM for PS with ECC 64bit, 4GB DDR4 RAM for PL |
| Storage | 8GB eMMC Flash Expandable up to 128GB |
| Two High Density Board to Board Connectors Interfaces | PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16 PL-GTH High Speed Transceivers (up to 16.3Gbps) x 16 |
| Two 240pin High Speed Board to Board Connectors Interfaces | From PL Block:
From PS Block:
|
| General Features |
|
*Under Progress

- 100G Ethernet though QSFP28/QSFP+ Connector
- 112G FireFly Connector
- 10G Ethernet through SFP+ Connector
- 12G SDI Video IN through HD BNC Connector
- 12G SDI Video OUT through HD BNC Connector
- 4K HDMI 2.0 IN through HDMI Connector
- 4K HDMI 2.0 OUT through HDMI Connector
- Dual FMC High Pin Count (HPC) Connector
- DP 1.2a Display Port Connector
- PCIe Gen2 x4 & M.2 SATA 3.1 Connector
- USB 3.0 OTG through TypeC Connector
- Dual Gigabit Ethernet through RJ45MagJack
- USB2.0 OTG through MicroAB Connector
- Standard SD & Dual PMOD Connector
- CAN Header & 20 Pin Header (for PS IOs)
- Operating Temperature: -20°C to +85°C
- Form Factor: 140mm x 170mm
For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC System on Module.



