Zynq™ UltraScale+™ ZU7/ZU5/ZU4 System on Module

Zynq™ UltraScale+™ MPSoC Family with FBVB900 Package
Compatible with Zynq UltraScale+ ZU7/5/4 CG/EG/EV Devices
Up to 504K Logic Cells & 230K LUTs
4GB DDR4 with ECC for PS, 1GB DDR4 for PL & 8GB eMMC Flash
4 PS GTR Transceivers & 16 GTH Transceivers
2 x 240pin High Speed Connectors with 142 user IOs

CONTACT SALES

Design Support

SOM/SBC Selection Guide
SOM 3D STEP
Library Symbol
CAD Symbol
Carrier Schematics

Software

Linux User Manual
Linux - BSP
Ubuntu User Manual
Ubuntu - BSP
Bare-Metal User Manual
Bare-Metal - BSP
VxWorks User Manual
VxWorks - BSP

Features	Details
ZU7/ZU5/ZU4 – Zynq^TM Ultrascale+^TM MPSoC	Processing System (PS) Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz 264/H.265 Video Encoder/Decoder (VCU) Arm Mali-400MP2 GPU @677MHz Programming Logic (PL) Up to 504K Logic cells & 230K LUTs PL GTH High Speed Transceivers x 16 @16.3 Gbps 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable up to 8GB) 16bit, 2GB DDR4 RAM for PL (Upgradable up to 4GB) 8GB eMMC Flash (Upgradable) RGMII Ethernet PHY Transceiver USB2.0 ULPI Transceiver
Board to Board Connectors Interfaces	From PS Block PS-GTR High Speed Transceivers (upto 6Gbps) x 2 Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY) USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver) RGMII Interface or ULPI Interface x 1 SD (4bit) x 1, SPI x 1, CAN x 2 Debug UART x 1, Data UART x 1 I2C x 2, PS JTAG From PL Block PL-GTH High Speed Transceivers (up to 16.3Gbps) x 16 PL IOs – 142 IOs HP Bank IOs – Up to 48 LVDS IOs/96 Single ended (SE) HD Bank IOs – Up to 23 LVDS IOs/46 Single ended (SE) GC Global Clock Input pins – Up to 15 LVDS/SE
General Features	Power Input: 5V through B2B Connector Form Factor: 95mm X 75mm(OREN) BSP Support: Linux BSP – Petalinux 2022.2 Baremetal BSP – Vivado 2020.1 Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant Compliance: CE*

Features

Details

ZU7/ZU5/ZU4 – Zynq^TM Ultrascale+^TM MPSoC

Processing System (PS)

- Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
- 264/H.265 Video Encoder/Decoder (VCU)
- Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL)

- Up to 504K Logic cells & 230K LUTs
- PL GTH High Speed Transceivers x 16 @16.3 Gbps
- 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable up to 8GB)
- 16bit, 2GB DDR4 RAM for PL (Upgradable up to 4GB)
- 8GB eMMC Flash (Upgradable)
- RGMII Ethernet PHY Transceiver
- USB2.0 ULPI Transceiver

Board to Board Connectors Interfaces

From PS Block

- PS-GTR High Speed Transceivers (upto 6Gbps) x 2
- Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
- USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
- RGMII Interface or ULPI Interface x 1
- SD (4bit) x 1, SPI x 1, CAN x 2
- Debug UART x 1, Data UART x 1
- I2C x 2, PS JTAG

From PL Block

- PL-GTH High Speed Transceivers (up to 16.3Gbps) x 16
- PL IOs – 142 IOs
- HP Bank IOs – Up to 48 LVDS IOs/96 Single ended (SE)
- HD Bank IOs – Up to 23 LVDS IOs/46 Single ended (SE)
- GC Global Clock Input pins – Up to 15 LVDS/SE

General Features

Power Input: 5V through B2B Connector
Form Factor: 95mm X 75mm(OREN)
BSP Support:
- Linux BSP – Petalinux 2022.2
- Baremetal BSP – Vivado 2020.1
Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*

*Under Progress

10G Ethernet through SFP+ Connector
3G/12G SDI Video IN through HD BNC Connector
3G/12G SDI Video OUT through HD BNC Connector
Dual FMC High Pin Count (HPC) Connector
DP1.2a Display Port Connector
PCIe Gen2 x4 Connector
M.2 SATA 3.1 Connector
USB 3.0 OTG through TypeC Connector
Dual Gigabit Ethernet through RJ45MagJack
USB2.0 OTG through MicroAB Connector
Standard SD Connector
CAN Header
Dual PMOD Connector
RTC Coin Cell Holder
Operating Temperature: -20°C to +85°C
Form Factor: 130mm x 140mm

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